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Optimization of the plasma oxidation and abrasive polishing processes in plasma-assisted polishing for highly effective planarization of 4H-SiC

✍ Scribed by Deng, H.; Monna, K.; Tabata, T.; Endo, K.; Yamamura, K.


Book ID
122188215
Publisher
International Academy for Production Engineering
Year
2014
Tongue
English
Weight
934 KB
Volume
63
Category
Article
ISSN
0007-8506

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