Optically Transparent Composites Reinfor
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H. Yano; J. Sugiyama; A.βN. Nakagaito; M. Nogi; T. Matsuura; M. Hikita; K. Handa
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Article
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2005
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John Wiley and Sons
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English
β 207 KB
sist was spin-coated on the surface of PEG-modified silicon wafers. After exposure to UV light under a photomask, the wafers were immersed in developing solution and then etched via wet etching. The remaining photoresist was removed using acetone. Self-Assembly of Protein/Silica Nanoparticles in Mi