๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

On wire-grid representation of solid metallic surfaces

โœ Scribed by Rubinstein, A.; Rachidi, F.; Rubinstein, M.


Book ID
114624275
Publisher
IEEE
Year
2005
Tongue
English
Weight
560 KB
Volume
47
Category
Article
ISSN
0018-9375

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The random formation of micrometric crystals on Al bonding pads can be an issue affecting wire bonding metal pad quality. The dry etch chemistry used to remove final passivation dielectric layers from the top of the bonding Al pad area is in fact based mainly on fluorine-containing gases (such as CF