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On the use of high-impedance power supplies to reduce the substrate switching noise in system-on-chips

✍ Scribed by F. Fiori


Book ID
113800606
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
955 KB
Volume
52
Category
Article
ISSN
0026-2714

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## Abstract Optimum use of high‐impedance surfaces (HIS) in high‐speed printed circuit boards (PCBs) of two layers to mitigate the simultaneous switching noise (SSN) and radiated emission is presented. The optimum condition is obtained with two rows of square pads between which is the power supply