On the singularity of temperature gradient near an inclined crack terminating at bimaterial interface

✍ Scribed by Wen-Hwa Chen; Chin-Cheng Huang

• Publisher: Springer Netherlands
• Year: 1992
• Tongue: English
• Weight: 262 KB
• Volume: 58
• Category: Article
• ISSN: 1573-2673
• DOI: 10.1007/bf00048952

✦ Synopsis

This paper deals with the singularity of temperature gradient near an inclined crack terminating at a bimaterial interface. The temperature field is solved by considering the continuity of temperature and heat flux at the interface and appropriate thermal boundary conditions on crack surfaces. The singularity of temperature gradient around the crack tip is then studied for the cases for which the temperature on crack surfaces is prescribed or crack surfaces are insulated. It is found that, unlike the oscillatory singularity of the stress field, no oscillatory character near the crack tip is observed for these problems. The dependence of the singularity of temperature gradient on the inclined angle of crack and thermal conductivity ratio of two dissimilar media is also shown.