On the problem of thermal heat sinks in cryogenics

✍ Scribed by I.V. Velichkov

• Publisher: Elsevier Science
• Year: 1990
• Tongue: English
• Weight: 229 KB
• Volume: 30
• Category: Article
• ISSN: 0011-2275
• DOI: 10.1016/0011-2275(90)90053-f

✦ Synopsis

Combining thermal anchoring with electrical insulation, an important problem common to many cryogenic devices, is considered. An explicit and fairly simple mathematical solution concerning thermal heat sinks is presented. A procedure for estimation and calculation of the efficiency of thermal grounding is also demonstrated for some specific cases.