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On cellular spacing selection of Cu-Mn alloy under ultra-high temperature gradient and rapid solidification condition

✍ Scribed by Sen Yang; Weidong Huang; Xin Lin; Yunpeng Su; Yaohe Zhou


Book ID
114389104
Publisher
Elsevier Science
Year
2000
Tongue
English
Weight
491 KB
Volume
42
Category
Article
ISSN
1359-6462

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