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Numerical Thermal Analysis of a Wireless Cortical Implant with Two-Body Packaging

✍ Scribed by Kanber Mithat Silay; Catherine Dehollain; Michel Declercq


Book ID
107683120
Publisher
Springer US
Year
2011
Tongue
English
Weight
587 KB
Volume
1
Category
Article
ISSN
2191-1630

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