Numerical simulations of void growth in aluminum alloy AA5083 during elevated temperature deformation

✍ Scribed by Ningning Du; Allan F. Bower; Paul E. Krajewski

• Book ID: 108214799
• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 1023 KB
• Volume: 527
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2010.04.010