๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Numerical simulation of thermal discharge based on FVM method

โœ Scribed by Yu Yunli; Wang Deguan; Wang Zhigang; Lai Xijun

Publisher
SP Science Press
Year
2006
Tongue
English
Weight
395 KB
Volume
5
Category
Article
ISSN
1672-5182

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Numerical simulation of underfill encaps
Numerical simulation of underfill encapsulation process based on characteritsic split method
โœ Venkatesh M. Kulkarni; K. N. Seetharamu; Ishak Abdul Azid; P. A. Aswatha Narayan ๐Ÿ“‚ Article ๐Ÿ“… 2006 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 334 KB

## Abstract Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the substrate. For better mould design and optimization of the proce