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Numerical simulation of sheet stamping process using flexible punch

✍ Scribed by Ramezani, M; Ripin, Z M; Ahmad, R

Book ID
121400800
Publisher
SAGE Publications
Year
2009
Tongue
English
Weight
488 KB
Volume
223
Category
Article
ISSN
0954-4054

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A transfer stamping process is proposed to fabricate micro-scale organic flexible electrodes. With different adhesion forces of the transferring interfaces, ink/mold and ink/substrate, patterns are formed from the relief features of the elastomeric mold to the substrate without residual layer, and n