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Numerical Simulation of Metal Plasma Immersion Ion Implantation (MePIIID) on a Sharp Cone and a Fine Tip by a Multiple-Grid Particle-in-Cell (PIC) Method
✍ Scribed by Kwok, D.T.K.; Cornet, C.
- Book ID
- 120535482
- Publisher
- IEEE
- Year
- 2006
- Tongue
- English
- Weight
- 538 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0093-3813
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