Numerical simulation of laser-induced transient temperature field in film-substrate system by finite element method
โ Scribed by B.Q. Xu; Z.H. Shen; J. Lu; X.W. Ni; S.Y. Zhang
- Publisher
- Elsevier Science
- Year
- 2003
- Tongue
- English
- Weight
- 211 KB
- Volume
- 46
- Category
- Article
- ISSN
- 0017-9310
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โฆ Synopsis
The transient temperature fields generated by a pulsed laser in film-substrate system are obtained by using the finite element method. Time integrations of the semi-discrete finite element equations are achieved by using approximate one order derivative of temperature. The temperature dependences of material properties are taken into account, which has a great influence on the temperature fields indicated by the numerical results. The pulsed laser-induced transient temperature fields in aluminum/methyl-methacrylate system and aluminum/copper system are obtained, which will be useful in the research on thermoelastic excitation of laser ultrasonic waves in film-substrate system.
๐ SIMILAR VOLUMES
Interface delamination and arching of a ductile thin film on a hard substrate subject to microwedge indentation were investigated systematically using a three-dimensional finite element method. A traction-separation law was introduced to simulate the cohesion and failure behavior of the interface be