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Numerical simulation of an axial flow package dyeing machine

✍ Scribed by R. Burley; P.-C. Wai; G.R. McGuire

Publisher
Elsevier Science
Year
1985
Tongue
English
Weight
733 KB
Volume
9
Category
Article
ISSN
0307-904X

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We developed a numerical method for simulating the underfill flow of conventional capillary flow and no-flow types in flip-chip packaging. The analytical models for the two types of underfill encapsulation processes are proposed. In the capillary flow type, the underfill material is driven into the