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Numerical simulation and fabrication of microscale, multilevel, tapered mold inserts using UV-Lithographie, Galvanoformung, Abformung (LIGA) technology

✍ Scribed by Ren Yang; J. Jiang; W. J. J. Meng; Wanjun Wang


Book ID
106184862
Publisher
Springer-Verlag
Year
2006
Tongue
English
Weight
707 KB
Volume
12
Category
Article
ISSN
0946-7076

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