Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal

✍ Scribed by K. Ohsasa; T. Narita; T. Shinmura

• Book ID: 111785863
• Publisher: ASM International
• Year: 1999
• Tongue: English
• Weight: 172 KB
• Volume: 20
• Category: Article
• ISSN: 1054-9714
• DOI: 10.1361/105497199770335721