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Numerical modeling of microstriplines with substrates with arbitrarily varying thickness with the use of the TLM method

✍ Scribed by S. Ahyoud; A. El Moussaoui; M. Essaaidi; M. Khalladi

Publisher: John Wiley and Sons
Year: 2002
Tongue: English
Weight: 111 KB
Volume: 34
Category: Article
ISSN: 0895-2477
DOI: 10.1002/mop.10369

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✦ Synopsis

Abstract

The symmetrical condensed‐node TLM method is used for the analysis of microstrip lines with substrates of arbitrary varying thickness. This numerical technique has been efficiently used for the computation of the propagation constant and the characteristic impedance of this structure. Moreover, it has been demonstrated that the shape of the microstrip substrate is also an important parameter for controlling the values of its characteristic impedance. The validity of the obtained results is proved by comparisons with those obtained from the literature. © 2002 Wiley Periodicals, Inc. Microwave Opt Technol Lett 34: 48–51, 2002; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.10369

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