Polymer thin films are widely used as coatings and interlevel dielectrics in microelectronic applications. In thin-film structures, stresses are generated due to interaction with adjacent layers and film shrinkage due to solvent evaporation or curing. This causes polymer chain orientation resulting
β¦ LIBER β¦
Novel technique for measuring through-plane modulus in thin polymer films
β Scribed by Patel, K.S.; Kohl, P.A.; Bidstrup-Allen, S.A.
- Book ID
- 114561980
- Publisher
- IEEE
- Year
- 1998
- Tongue
- English
- Weight
- 128 KB
- Volume
- 21
- Category
- Article
- ISSN
- 1070-9894
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