Novel Isotropical Conductive Adhesives for Electronic Packaging Application
โ Scribed by Yu Tao; Yanping Xia; Hui Wang; Fanghong Gong; Haiping Wu; Guoliang Tao
- Book ID
- 118697314
- Publisher
- IEEE
- Year
- 2009
- Tongue
- English
- Weight
- 832 KB
- Volume
- 32
- Category
- Article
- ISSN
- 1521-3323
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
Polyurethane composites filled with alumina or carbon fibers were prepared to study the thermal conductivities and dielectric properties of polymer composites under humid environments. The thermal conductivities of these polymer composites in relation to filler concentrations and filler sizes were i
Electrically conductive adhesives (ECAs) have been explored as a tin/lead (Sn/Pb) solder alternative for attaching encapsulated surface mount components on rigid and flexible printed circuits. However, limited practical use of conductive adhesives in surface mount applications is found because of th