✦ LIBER ✦
Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications
✍ Scribed by Sabuj Mallik, Erica Hiu Laam Chan, Ndy Ekere
- Book ID
- 120946385
- Publisher
- Springer US
- Year
- 2012
- Tongue
- English
- Weight
- 915 KB
- Volume
- 22
- Category
- Article
- ISSN
- 1059-9495
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