Nonhermetic plastic packaging of high voltage electronic switches utilizing a low-stress glob coating for 95/5Pb/Sn solder joints of flip-chip bonded multichip module high voltage devices

✍ Scribed by Ching Ping Wong; Segelken, J.M.; Tai, K.L.; Wong, C.C.

• Book ID: 114560643
• Publisher: IEEE
• Year: 1998
• Weight: 122 KB
• Volume: 21
• Category: Article
• ISSN: 1083-4400
• DOI: 10.1109/3476.670026