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Nondestructive inspection of delamination in IC packages by high-frequency microwaves

✍ Scribed by Y. Ju; M. Saka; H. Abé

Book ID: 118606749
Publisher: Elsevier Science
Year: 2001
Tongue: English
Weight: 257 KB
Volume: 34
Category: Article
ISSN: 0963-8695
DOI: 10.1016/s0963-8695(00)00059-1

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