New Reconfigurable Fiber–Chip Coupling Method for Multipurpose Packaging with up to 50 GHz Modulation Bandwidth
✍ Scribed by U.H.P. Fischer; K. Peters; R. Ziegler; D. Pech; A. Kilk; Th. Eckhardt; G.G. Mekonnen; G. Jacumeit
- Publisher
- Elsevier Science
- Year
- 2000
- Tongue
- English
- Weight
- 262 KB
- Volume
- 6
- Category
- Article
- ISSN
- 1068-5200
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✦ Synopsis
We designed and fabricated a series of modules for one-sided and doublesided fiber-chip coupling of waveguide-fed InP and GaAs OEICs such as diode lasers, semiconductor amplifiers, and optical modulators. Simultaneous coupling of both chip sides to the fiber is possible with a new patented set-up. The modules are temperature controlled within an ambient temperature range from y10 to q50ЊC and electrical modulation signals up to 45 GHz can be fed via RF connectors to the OEIC. The coupling loss is typically less than 3 dB with tapered fibers. The package shows good longterm stability and is well suited for prototypes and small-scale production.