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New mechanisms of void growth in Au–Al wire bonds: Volumetric shrinkage and intermetallic oxidation

✍ Scribed by H. Xu; C. Liu; V.V. Silberschmidt; S.S. Pramana; T.J. White; Z. Chen; V.L. Acoff


Book ID
113899121
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
681 KB
Volume
65
Category
Article
ISSN
1359-6462

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