✦ LIBER ✦
New gold alloy for aluminum bonding in MOS hermetic packages : Raymond L. Dietz. Proc. Electron. Components Conf. Arlington, Va., May 16–18, 1977. p. 367
- Publisher
- Elsevier Science
- Year
- 1977
- Tongue
- English
- Weight
- 132 KB
- Volume
- 16
- Category
- Article
- ISSN
- 0026-2714
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