✦ LIBER ✦
New generation of Self Ionized Plasma copper seed for sub 40 nm nodes
✍ Scribed by J. Guillan; K. Haxaire; S. Chhun; E. Richard; M.C. Luche; L. Arnaud; E. Petitprez; C. Monget; D. Galpin; P. Normandon
- Book ID
- 104052720
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 540 KB
- Volume
- 88
- Category
- Article
- ISSN
- 0167-9317
No coin nor oath required. For personal study only.
✦ Synopsis
Two seed deposition hardware are compared in this paper: a standard Self Ionized Plasma (SIP) standard chamber and a new generation chamber allowing Cu deposition and re-sputtering simultaneously. TEM characterizations exhibits better features coverage for new seed generation thank to process fine tuning. It induces defectivity improvement and void density is reduced with new hardware. Furthermore, reliability performances are improved without degrading parametrical results.