New bubble-memory packaging cuts board space and manufacturing costs : Art Thorp. Electronics, 128 (24 March 1983)

• Publisher: Elsevier Science
• Year: 1983
• Tongue: English
• Weight: 108 KB
• Volume: 23
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(83)90862-4