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New application of polyimide in uncooled a-Si TFT infrared sensors

โœ Scribed by Xing-Ming Liu; Lin Han; Li-Tian Liu


Book ID
104051279
Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
376 KB
Volume
38
Category
Article
ISSN
0026-2692

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โœฆ Synopsis


New application of polyimide (PI) is introduced in this paper. PI film of 27 mm is achieved, and the excellent thermal-isolation performance of the film is simulated by ANSYS. The surface of film is flat, which is suitable for the fabrication of other materials such as aluminum and silicon nitride. The PI film is used as thermal-isolation layer of uncooled a-Si thin film transistor infrared sensors in this research, and the fabrication process is greatly simplified.


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