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NASA thermal control technologies for robotic spacecraft

✍ Scribed by Theodore D. Swanson; Gajanana C. Birur

Book ID
104395347
Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
316 KB
Volume
23
Category
Article
ISSN
1359-4311

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The current trend in spacecraft design toward high-density packing of the payload electronics and increased waste heat flux will require the development of lightweight high thermal conductive materials and innovative thermal control techniques. Additionally, new challenging missions will require new