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Nanoindentation of lead-free solders in microelectronic packaging

✍ Scribed by C.Z. Liu; J. Chen

Book ID: 103842148
Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 443 KB
Volume: 448
Category: Article
ISSN: 0921-5093
DOI: 10.1016/j.msea.2006.10.056

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