## Abstract **Summary:** Polyaniline‐dodecybenzenesulfonic acid (PANI‐DBSA)/epoxy resin (EP) blends were prepared by a solution‐in‐toluene process and direct mixing of PANI‐DBSA with EP. The dispersion quality of PANI‐DBSA proved to be strongly related to the final electrical properties of the cure
Nanoindentation and Morphological Studies of Epoxy Nanocomposites
✍ Scribed by Lu Shen; Lei Wang; Tianxi Liu; Chaobin He
- Publisher
- John Wiley and Sons
- Year
- 2006
- Tongue
- English
- Weight
- 360 KB
- Volume
- 291
- Category
- Article
- ISSN
- 1438-7492
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✦ Synopsis
Abstract
Summary: This paper investigates the mechanical properties of the epoxy–organoclay nanocomposites by the nanoindentation technique. The nanocomposites were prepared by in situ polymerization and a mixture of exfoliated and intercalated composites structure was obtained as evidenced by X‐ray diffraction (XRD) and transmission electron microscopy (TEM). The hardness, elastic modulus, and the creep behavior of the nanocomposites have been evaluated as a function of clay concentration. It has been found that incorporation of 7.5 wt.‐% of clay nanofiller enhances the elastic modulus and hardness of the epoxy matrix by about 20 and 6%, respectively. The elastic modulus data calculated from indentation experiments are comparable with those obtained from a tensile test. An optimum clay loading level was found to be 2.5 wt.‐% to maximum enhance the creep resistance of the epoxy matrix. The lowered creep resistance with higher clay loading could be due to the reduced crosslinking density near the clay surface caused by the plasticizing effect from the pending of alkyl ammonium chains on the clay surface. An attempt has been made to correlate the fracture toughness of the nanocomposites with the ratio of modulus to hardness obtained from nanoindentation experiments.
Ratio of modulus to hardness (E/H) and the fracture toughness (K~IC~) versus clay loading for the epoxy nanocomposites.
magnified imageRatio of modulus to hardness (E/H) and the fracture toughness (K~IC~) versus clay loading for the epoxy nanocomposites.
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