✦ LIBER ✦
Multiphysics simulations of cure residual stresses and springback in a thermoset resin using a viscoelastic model with cure-temperature-time superposition
✍ Scribed by Patham, Bhaskar
- Book ID
- 120210623
- Publisher
- John Wiley and Sons
- Year
- 2012
- Tongue
- English
- Weight
- 1010 KB
- Volume
- 129
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.