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Multi-way principal component analysis for the endpoint detection of the metal etch process using the whole optical emission spectra

✍ Scribed by Kyounghoon Han; Kun Joo Park; Heeyeop Chae; En Sup Yoon


Book ID
107513841
Publisher
Springer US
Year
2008
Tongue
English
Weight
466 KB
Volume
25
Category
Article
ISSN
0256-1115

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