Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance

✍ Scribed by Valeriy Sukharev; Armen Kteyan; Jun-Ho Choy; Henrik Hovsepyan; Ara Markosian; Ehrenfried Zschech; Rene Huebner

• Book ID: 106384569
• Publisher: Springer US
• Year: 2011
• Tongue: English
• Weight: 514 KB
• Volume: 28
• Category: Article
• ISSN: 0923-8174
• DOI: 10.1007/s10836-011-5259-y