Multi-scale modeling of direct copper plating on resistive non-copper substrates

✍ Scribed by Liu Yang; Aleksandar Radisic; Magi Nagar; Johan Deconinck; Philippe M. Vereecken; Alan C. West

• Book ID: 116445415
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 819 KB
• Volume: 78
• Category: Article
• ISSN: 0013-4686
• DOI: 10.1016/j.electacta.2012.06.076