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Morphology, thermal, and mechanical properties of polyamide 66/clay nanocomposites with epoxy-modified organoclay

✍ Scribed by Park Min Gyoo; Sriram Venkataramani; Sung Chul Kim

Publisher: John Wiley and Sons
Year: 2006
Tongue: English
Weight: 754 KB
Volume: 101
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.23339

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