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Morphology, Electrical, and Rheological Properties of Silane-Modified Silver Nanowire/Polymer Composites

✍ Scribed by Yi-Hsiuan Yu; Chen-Chi M. Ma; Siu-Ming Yuen; Chih-Chun Teng; Yuan-Li Huang; Ikai Wang; Ming-Hsiung Wei

Publisher
John Wiley and Sons
Year
2010
Tongue
English
Weight
754 KB
Volume
295
Category
Article
ISSN
1438-7492

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✦ Synopsis

Abstract

Electrically conducting films containing AgNws, hydrophilic and hydrophobic resins were prepared. FT‐IR reveals that the interface between the AgNws and epoxy could be successfully modified by APTES. XPS shows that the AgNws were attracted by hydrogen bonds of NH~2~ and NH groups after APTES modification. SEM analysis shows that the AgNws were well dispersed in the resin. The AgNws were also blended with hydrophilic and acrylic resins, and the resulting blends were compared with AgNws/epoxy blends. Results show that AgNw/PVA‐resin films possess the lowest surface electrical resistance. The AgNw/PVA‐resin and silane‐modified AgNw/epoxy resin conductive films possess a similar electrical percolation threshold.
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## Abstract Commercially available organoclay (Closite 30B) was modified by using 3‐aminopropyltriethoxysilane (APS) via a silylation reaction. Sodium clay (Closite Na) was treated by APS directly as a control. Such modified clays were further melt‐compounded with polybutylene terephthalate (PBT).