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Morphology and Pull Strength of Sn-Ag(-Co) Solder Joint with Copper Pad

โœ Scribed by Hiroshi Nishikawa; Akira Komatsu; Tadashi Takemoto

Publisher
Springer US
Year
2007
Tongue
English
Weight
528 KB
Volume
36
Category
Article
ISSN
0361-5235

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This study forms composite solders by adding 0.5-3 wt% of Ni particles in situ to Sn-3.5 wt%Ag lead-free solder. Cu/solder/Cu specimens are prepared by dipping two Cu rods into a solder bath to produce a solder joint. Some of the joint specimens are retained in the as-soldered condition, while the o