✦ LIBER ✦
Morphology and adhesion strength in electroless Cu metallized AlN substrate
✍ Scribed by Chang, J.H.; Duh, J.G.; Chiou, B.S.
- Book ID
- 114560519
- Publisher
- IEEE
- Year
- 1993
- Tongue
- English
- Weight
- 907 KB
- Volume
- 16
- Category
- Article
- ISSN
- 0148-6411
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