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Monitoring wire bonding via time-frequency analysis of horn vibration

✍ Scribed by Dong Zhang; Shih-fu Ling

Book ID: 126652112
Publisher: IEEE
Year: 2003
Tongue: English
Weight: 319 KB
Volume: 26
Category: Article
ISSN: 1521-334X
DOI: 10.1109/TEPM.2003.820800

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