Monitoring Solder Fatigue in a Power Module Using Case-Above-Ambient Temperature Rise

✍ Scribed by Dawei Xiang; Li Ran; Tavner, P.; Bryant, A.; Shaoyong Yang; Mawby, P.

• Book ID: 117918183
• Publisher: IEEE
• Year: 2011
• Tongue: English
• Weight: 1012 KB
• Volume: 47
• Category: Article
• ISSN: 0093-9994
• DOI: 10.1109/tia.2011.2168556