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Molecular dynamics simulations of low-energy argon ion sputtering of copper clusters on polyethylene surfaces

โœ Scribed by O.A. Yermolenko; G.V. Kornich; G. Betz


Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
672 KB
Volume
269
Category
Article
ISSN
0168-583X

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โœฆ Synopsis


The normal bombardment of the targets consisted of single 13-, 27-or 39-atom copper cluster on a surface of polyethylene by Ar ions with energies of 100, 200 and 400 eV is examined using molecular dynamics simulation incorporating long-range many-body covalent bonding potential for hydrocarbons and a potential based on a embedded atom model for copper. Sputtering yield and its dependence on the energy of bombarding ion and size of the pre-deposited copper cluster are discussed.


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## Abstract Molecular dynamics simulations are used to study the interaction between incident copper ions, SF~6~ molecules and a polyethylene surface. Average particle velocities from 15 to 21โ€‰kmโ€‰ยทโ€‰s^โˆ’1^ are tested in steps of 2โ€‰kmโ€‰ยทโ€‰s^โˆ’1^. The damage to the polyethylene crystal is reviewed in term