Molecular dynamics simulations have been performed of sputtering of copper clusters, which consisted of 13, 39, 75 and 195 Cu atoms, on a (0 0 0 1) graphite surface by 200 eV Ar ions. The role of multiple Ar-Cu and Ar-C interactions in the polar distributions of backscattered Ar ions was investigate
Molecular dynamics simulations of low-energy argon ion sputtering of copper clusters on polyethylene surfaces
โ Scribed by O.A. Yermolenko; G.V. Kornich; G. Betz
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 672 KB
- Volume
- 269
- Category
- Article
- ISSN
- 0168-583X
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โฆ Synopsis
The normal bombardment of the targets consisted of single 13-, 27-or 39-atom copper cluster on a surface of polyethylene by Ar ions with energies of 100, 200 and 400 eV is examined using molecular dynamics simulation incorporating long-range many-body covalent bonding potential for hydrocarbons and a potential based on a embedded atom model for copper. Sputtering yield and its dependence on the energy of bombarding ion and size of the pre-deposited copper cluster are discussed.
๐ SIMILAR VOLUMES
## Abstract Molecular dynamics simulations are used to study the interaction between incident copper ions, SF~6~ molecules and a polyethylene surface. Average particle velocities from 15 to 21โkmโยทโs^โ1^ are tested in steps of 2โkmโยทโs^โ1^. The damage to the polyethylene crystal is reviewed in term