Molecular dynamics simulation of thermal conductivity of Cu–Ar nanofluid using EAM potential for Cu–Cu interactions

✍ Scribed by Hongbo Kang; Yuwen Zhang; Mo Yang

• Book ID: 118782107
• Publisher: Springer
• Year: 2011
• Tongue: English
• Weight: 394 KB
• Volume: 103
• Category: Article
• ISSN: 1432-0630
• DOI: 10.1007/s00339-011-6379-z