Modification of two-component bismaleimide resin by blending (meth)allyl compounds as third components
✍ Scribed by Iijima, Takao; Yuasa, Noriyuki; Tomoi, Masao
- Publisher
- John Wiley and Sons
- Year
- 1999
- Tongue
- English
- Weight
- 108 KB
- Volume
- 48
- Category
- Article
- ISSN
- 0959-8103
No coin nor oath required. For personal study only.
✦ Synopsis
A two-component bismaleimide resin composed of 4,4'-bismaleimidediphenyl methane (BDM) and o,o'-diallyl bisphenol A (DBA) (Matrimid 5292 resin) was used as a parent bismaleimide resin. Modi®cation of the parent bismaleimide resin was examined using several kinds of (meth)allyl compounds as the third component. The (meth)allyl compounds include triallyl isocyanurate (TAIC), o,o'-dimethallyl bisphenol A (DMBA) and trimethallyl isocyanurate (TMAIC). In the ternary BDM/ DBA/TAIC blends, the fracture toughness K IC and ¯exural strength for the cured resins decreased with increasing TAIC content; thermal properties of the cured resins were not deteriorated. In the ternary BDM/DBA/DMBA blends, K IC and ¯exural modulus for the cured resins increased and their glass transition temperatures decreased with an increase in DMBA content. Flexural strength increased up to DMBA 70 eq% blend and then decreased. In the ternary blend of BDM/DBA/TMAIC (1.0/0.5/0.5), K IC for the blend increased 15%, with retention of ¯exural property and T g . In the ternary BDM/ DMBA/TMAIC (1.0/0.5/0.5) blend, the cured resin had balanced properties and its K IC increased 50% compared to the cured Matrimid resin.