Modification of Polymer Substrates with Low Surface Free Energy Material by Low-Temperature Cured Polybenzoxazine

✍ Scribed by Chun-Syong Liao; Jiann-Shing Wu; Chih-Feng Wang; Feng-Chih Chang

• Publisher: John Wiley and Sons
• Year: 2008
• Tongue: English
• Weight: 236 KB
• Volume: 29
• Category: Article
• ISSN: 1022-1336
• DOI: 10.1002/marc.200700646

✦ Synopsis

Abstract

The B‐ala/AIBN PBZ system has a high extent of ring‐opening of oxazine because phenol‐containing oligomers are formed at the early stage of the curing process. As a result, the B‐ala/AIBN PBZ system possesses a relatively stronger intramolecular hydrogen bonding and lower surface energy than the pure B‐ala system at low temperature curing. In this context, poly(4‐vinyl pyridine), poly(4‐vinyl phenol) thin films and polycarbonate substrates, which lack liquid resistance, possess low surface free energy after modification with B‐ala/AIBN = 5/1 PBZ.

magnified image