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Modelling the upper yield point and the brittle–ductile transition of silicon wafers in three-point bend tests

✍ Scribed by Roberts, S. G.; Hirsch, P. B.


Book ID
127348846
Publisher
Taylor and Francis Group
Year
2006
Tongue
English
Weight
430 KB
Volume
86
Category
Article
ISSN
1478-6435

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