Modelling the transient liquid phase bonding behaviour of a duplex stainless steel using copper interlayers

✍ Scribed by T. Padron; T.I. Khan; M.J. Kabir

• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 347 KB
• Volume: 385
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2004.06.034