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Modelling the creep rates of eutectic Bi–Sn solder using the data from its constitutive phases

✍ Scribed by C. H. Raeder; D. Mitlin; R. W. Messler


Book ID
111534548
Publisher
Springer
Year
1998
Tongue
English
Weight
676 KB
Volume
33
Category
Article
ISSN
0022-2461

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