๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Modelling and prediction of copper concentration of a grinding process

โœ Scribed by U.K.J. Kortela; Timo J. Niemi

Publisher
Elsevier Science
Year
1978
Tongue
English
Weight
618 KB
Volume
14
Category
Article
ISSN
0005-1098

No coin nor oath required. For personal study only.

โœฆ Synopsis

A discrete Kalman filter and predictor, used with a dynamic model of a grinding circuit in copper concentration, provides good advance information of the copper concentration for the feedforward optimal control of the flotation process.

๐Ÿ“œ SIMILAR VOLUMES

A process model of wafer thinning by dia
A process model of wafer thinning by diamond grinding
โœ Chao-Chang A. Chen; Li-Sheng Hsu ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 942 KB

This paper is to develop and investigate a wafer thinning process model (WTPM) to integrate the wafer thickness into set-up parameters and predict total thickness variation (TTV) of ground wafers with modification of the wafer grinding process model (WGPM) developed previously. Due to the variation