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Modelling and experimental investigation of microwave heating of adhesively bonded polypropylene joint

✍ Scribed by Hing Wa So; Alexander Taube

Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
261 KB
Volume
24
Category
Article
ISSN
0143-7496

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✦ Synopsis

Microwave heating of single lap adhesive-bonded joints with polypropylene adherends having very low loss factor was studied. The adhesive joint was heated in an applicator based on a standard rectangular waveguide WR340 operating at 2.45 GHz frequency in the dominant TE 10 mode. The temperatures at different locations in the adhesive layer were measured. A two-dimensional numerical model was developed to determine the temperature distribution in the adhesive layer of the modelled joints during the process. Finite-difference time-domain method was used for solving the governing differential equations. The experimental and the simulation results showed that the numerical model was reasonably accurate to represent the curing process.

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